Semicon 2.0

India launches Semicon 2.0 as a comprehensive programme to strengthen the country’s semiconductor design and manufacturing ecosystem. Semicon 2.0 expands the India Semiconductor Mission (ISM) and is designed to holistically build a complete chip design and manufacturing ecosystem in the country.

Semicon 2.0 Programme:

Dimension	Key Details
Programme nature	Semicon 2.0 comprises an expansion of the India Semiconductor Mission (ISM) designed to holistically build a complete chip design and manufacturing ecosystem in India.
Aim	Semicon 2.0 provides for positioning India as a global semiconductor design intellectual property (IP) hub.
Six pillars	Semicon 2.0 comprises six pillars: Design; Machines and Materials; Fabs; ATMP/OSAT; Research & Development; Talent Development.
Pillar: Design	The Design pillar provides for deepening chip design capabilities with a focus on IP and system designs.
Pillar: Machines and Materials	The Machines and Materials pillar provides for incentivising companies in manufacturing and R&D of machines, chemicals, and gases essential for semiconductor production, which supports precision manufacturing.
Pillar: Fabs	The Fabs pillar provides for a first fab scheduled for 2028 and includes silicon fabs, compound semiconductor fabs, discrete component fabs, and display fabs.
Definition	A fab authorises a semiconductor fabrication (fab) plant.
Pillar: ATMP/OSAT	The ATMP/OSAT pillar provides for strengthening Assembly, Testing, Marking, Packaging (ATMP) and Outsourced Semiconductor Assembly and Test (OSAT).
Pillar: Research & Development	The Research & Development pillar provides for current nodes of 28nm–110nm and focuses on developing advanced nodes and technologies in collaboration with leading R&D centres in India and abroad.
Pillar: Talent Development	The Talent Development pillar comprises 315 universities engaged in chip design training with the latest EDA tools and provides for further deepening the training in college.