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Centre Sanctions 24 Chip Design Projects Under MeitY’s Design Linked Incentive Scheme
The Centre sanctions 24 chip design projects under the Design Linked Incentive (DLI) scheme of MeitY. Projects supported under the scheme report outputs including tape-outs, ASIC chips, patents, and leveraged private investment.
Design Linked Incentive (DLI) Scheme (MeitY)
| Dimension | Key Details |
|---|---|
| Current trigger | Centre sanctions 24 chip design projects under the DLI scheme. |
| Launched in | 2021. |
| Authority / Ministry | Launched by MeitY under the Semicon India Programme. |
| Nodal agency for implementation | C-DAC (Centre for Development of Advanced Computing). |
| Objective | Provides for catalysing a strong, self-reliant chip design ecosystem by providing financial incentives and access to advanced design infrastructure for domestic startups and MSMEs. |
| Financial incentive categories | Provides financial incentives under Product Design Linked Incentive and Deployment Linked Incentive. |
| Design infrastructure support mechanism | Provides Design Infrastructure Support through the ChipIN Centre to approved companies. |
| Components of design infrastructure support | Comprises remote access to a National EDA Tool Grid, a repository of IP Cores, and fiscal support for prototyping (MPW) and post-silicon validation. |
| Eligibility: startups and MSMEs | Start-ups and MSMEs are eligible for financial incentives and design infrastructure support for semiconductor product design and deployment. |
| Eligibility: other domestic companies | Other domestic companies are eligible for financial incentives for deploying semiconductor designs. |
| Reported outputs from supported projects | Comprises 16 tape-outs, 6 ASIC chips, 10 patents, and over 3x private investment leveraged. |